JP2589325B

• Main Authors: ANDO TAKASHI, YAMADA YUKIO, FUJIWARA YOSHIO
• Format: Patent
• Language: English
• Published: 12.03.1997
• Edition: 6
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; COMPOSITIONS BASED THEREON; CONDUCTORS; DYES; ELECTRICITY; INSULATORS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

PURPOSE:To obtain the title adhesive excellent in storage stability and properties after being formed into a film, by subjecting the curing agent to be used in an adhesive agent composition comprising a curing agent comprising a reaction product of an imidazole derivative with an epoxy compound, a film-forming resin composition containing an epoxy resin and a solvent to a specified treatment. CONSTITUTION:A curing agent composition is prepared by treating a curing agent comprising a reaction product of an imidazole derivative (e.g., imidazole) with an epoxy compound (e.g., bisphenol A glycidyl ether epoxy resin) with an isocyanate (e.g., tolylene diisocyanate) in a solvent (e.g., toluene) to be used in forming a film. A film-forming resin composition containing 100pts.wt. epoxy resin (e.g., bisphenol A type, liquid curable with this curing agent and a resin (e.g., urethane resin) optionally used for improving the film forming property is mixed with 15-70 pts.wt. said curing agent composition and a solvent (e.g., toluene) to obtain the title adhesive.