JP2538698B

There is disclosed a semiconductor integrated circuit device having: an external input signal lead (109) provided outside a semiconductor chip; a power supply lead (108) provided outside the semiconductor chip; a first electrode (104) connected to an internal circuit (102) on the semiconductor chip,...

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Bibliographic Details
Main Authors YUKANAMI KATSUJI, OOSHIMA SHIGEO
Format Patent
LanguageEnglish
Published 25.09.1996
Edition6
Subjects
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Summary:There is disclosed a semiconductor integrated circuit device having: an external input signal lead (109) provided outside a semiconductor chip; a power supply lead (108) provided outside the semiconductor chip; a first electrode (104) connected to an internal circuit (102) on the semiconductor chip, and arranged close to the external input signal lead, wherein when the circuit is caused to be operative, the first electrode is connected to the external input signal lead; and a second electrode (105) connected to the first electrode on the semiconductor chip, and arranged close to said power supply lead, wherein when the circuit is not caused to be operative, the second electrode is connected to the power supply lead. This invention is applicable to the device wherein there are provided a plurality of internal circuits (102a, 102b). In this case, a plurality of the first electrodes (104a, 104b) drawn out from the internal circuits are arranged close to the external input signal lead, and a plurality of the second electrodes (105a, 105b) similarly drawn out from the internal circuits are arranged close to the power supply lead.
Bibliography:Application Number: JP19900141883