HEAT-CONDUCTIVE SILICONE COMPOSITION, AND PRODUCTION METHOD OF THE COMPOSITION

• Main Authors: TAKAHASHI AKIHIRO, YAMADA SHUNSUKE
• Format: Patent
• Language: English; Japanese
• Published: 29.07.2024
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a heat conductive silicone composition giving a cured product generating no voids, and excellent in workability on account of its small physical characteristic (e.g., adhesiveness and hardness) change when exposing to a high temperature while having high heat radiation performance (e.g., 5.0 W/m K or more).SOLUTION: A heat-conductive silicone composition includes: an alkenyl group-containing organopolysiloxane as a component (A); a linear organopolysiloxane having two or more hydrosilyl groups in one molecule as a component (B); a hydrogenated cyclic siloxane having only a repeating unit of -SiRHO- and having a degree of polymerization of 4 or more and 8 or less as a component (C); an addition reaction catalyst as a component (D); and a heat-conductive filler as a component (E), where when the total amount of the component (A) and the component (B) is 100 pts.mass, the content of the component (C) is 0.5 pt.mass or more and 1.8 pts.mass or less, and the content of the component (E) is 500 pts.mass or more and 3,000 pts.mass or less.SELECTED DRAWING: None 【課題】 本発明では高い放熱性能（例えば5.0W/m・K以上）を有しながら、高温暴露時に物理特性（例えば接着性や硬度）の変化が少ないことによりボイドが生じない、かつ作業性に優れた硬化物を与える熱伝導性シリコーン組成物を提供することを課題とする。【解決手段】本発明に係る熱伝導性シリコーン組成物は、(A)成分であるアルケニル基含有オルガノポリシロキサンと、(B)成分である1分子中にヒドロシリル基を2個以上有する直鎖状のオルガノポリシロキサンと、(C)成分である-SiRHO-の繰り返し単位のみを有し、重合度が4以上8以下である水素化環状シロキサンと、(D)成分である付加反応触媒と、(E)成分である熱伝導性フィラーとを含み、(A)成分と(B)成分との合計量を100質量部としたときに、(C)成分の含有量が0.5質量部以上1.8質量部以下であり、(E)成分の含有量が500質量部以上3,000質量部以下である。【選択図】なし