MANUFACTURING METHOD FOR MAGNETIC MOLDED BODY AND MANUFACTURING METHOD FOR ANISOTROPIC BOND MAGNET
To provide a manufacturing method for a magnetic molded body for use in manufacturing an anisotropic bond magnet excellent in residual magnetic flux density and mechanical strength.SOLUTION: A manufacturing method for a magnetic molded body 10 includes: a supply step for supplying, into a mold, a co...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
08.07.2024
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a manufacturing method for a magnetic molded body for use in manufacturing an anisotropic bond magnet excellent in residual magnetic flux density and mechanical strength.SOLUTION: A manufacturing method for a magnetic molded body 10 includes: a supply step for supplying, into a mold, a compound 2 containing magnet powder, a thermosetting resin, and wax 4; a molding step for compressing the compound 2 in the mold while applying a magnetic field H to the compound 2 in the mold heated at a molding temperature Tm, and thereby forming a molded body 2A from the compound and removing the wax 4 from the molded body 2A; a demagnetizing step for demagnetizing, after the molding step, the molded body 2A; and a thermosetting step for heating, after the demagnetizing step, the molded body 2A at a temperature equal to or higher than the thermosetting temperature of the thermosetting resin to obtain a magnetic molded body. The magnet powder includes a Sm-Fe-N-based permanent magnet. The molding temperature Tm is equal to or higher than the dropping point of the wax 4 and lower than the thermosetting temperature of the thermosetting resin.SELECTED DRAWING: Figure 1
【課題】残留磁束密度及び機械的強度に優れた異方性ボンド磁石の製造に用いる磁性成形体の製造方法を提供すること。【解決手段】磁性成形体10の製造方法は、磁石粉末と熱硬化性樹脂とワックス4とを含むコンパウンド2を、型内に供給する供給工程と、成型温度Tmで加熱された型内のコンパウンド2へ磁場Hを印加しながら、型内のコンパウンド2を圧縮することにより、コンパウンドから成形体2Aを形成し、且つ成形体2Aからワックス4を除去する成型工程と、成型工程後、成形体2Aを脱磁する脱磁工程と、脱磁工程後、熱硬化性樹脂の熱硬化温度以上である温度で成形体2Aを加熱することにより、磁性成形体を得る熱硬化工程と、を含む。磁石粉末は、Sm-Fe-N系永久磁石を含む。成型温度Tmは、ワックス4の滴点以上であり、且つ熱硬化性樹脂の熱硬化温度未満である。【選択図】図1 |
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Bibliography: | Application Number: JP20230091870 |