LAMINATED ELECTRONIC COMPONENT

• Main Authors: LEE EUN JUNG, HONG YONG MIN, LEE JONG HO, KANG SIM CHUNG, PARK YONG, LEE JI HYEON, PARK JUNG JIN, KIM SU MIN, KIM MIN WOO, PARK JUNG TAE
• Format: Patent
• Language: English; Japanese
• Published: 26.06.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; ELECTRICITY

To reduce the stress applied to a dielectric layer by heat and pressure applied during a crimping and lamination process of a laminated electronic component, to reduce deformation of the laminated electronic component due to the external environment, and to protect a capacitance forming part of the laminated electronic component from cracks that may occur when the laminated electronic component is mounted.SOLUTION: The laminated electronic component includes a body including a dielectric layer and internal electrodes arranged alternately with the dielectric layer, and an external electrode arranged on the body. The dielectric layer includes nitrogen-doped polydopamine.SELECTED DRAWING: Figure 5 【課題】積層型電子部品の圧着及び積層工程で加えられる熱及び圧力によって誘電体層に加えられるストレスを減少させ、積層型電子部品の外部環境による変形を減少させ、積層型電子部品を実装する場合に発生し得るクラックから積層型電子部品の容量形成部を保護する。【解決手段】本発明の一実施形態による積層型電子部品は、誘電体層、及び上記誘電体層と交互に配置される内部電極を含む本体、及び上記本体上に配置される外部電極を含み、上記誘電体層は、窒素ドープされたポリドーパミンを含む。【選択図】図５