SEMICONDUCTOR MANUFACTURING APPARATUS, TOOL MOUNTING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

To provide a technology capable of preventing mounting of a tool that is not supported by a product.SOLUTION: A semiconductor manufacturing apparatus includes: a tool having a tag; a die treating unit exchangeably fitted to the tool; a reader writer reading data from the tag and writing data in the...

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Bibliographic Details
Main Authors NAKUI YUKI, SAITO AKIRA, MOCHIZUKI MASAYUKI
Format Patent
LanguageEnglish
Japanese
Published 26.06.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a technology capable of preventing mounting of a tool that is not supported by a product.SOLUTION: A semiconductor manufacturing apparatus includes: a tool having a tag; a die treating unit exchangeably fitted to the tool; a reader writer reading data from the tag and writing data in the tag; and a controller which compares the data read from the tag with prepossessed data and does not start production when comparison results do not correspond.SELECTED DRAWING: Figure 6 【課題】製品に対応しない治工具の装着を防止することが可能な技術を提供することにある。【解決手段】半導体製造装置は、タグを有する治工具と、前記治工具が交換可能に取り付けられるダイ取扱ユニットと、前記タグからデータを読み出したり、前記タグにデータを書き込んだりするリーダライタと、前記タグから読み出したデータと予め保持しているデータとを比較し、比較結果が一致しない場合、生産を開始しないよう構成される制御装置と、を備える。【選択図】図６
Bibliography:Application Number: JP20220199828