RESIN COMPOSITION, PREPREG, METAL SUBSTRATE WITH RESIN, AND WIRING BOARD

• Main Author: KAMO HIROMICHI
• Format: Patent
• Language: English; Japanese
• Published: 17.06.2024
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; COMPOUNDS THEREOF; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; INORGANIC CHEMISTRY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; NON-METALLIC ELEMENTS; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

To provide a resin composition and the like that enable the production of prepreg and cured products with small variations in relative dielectric constant.SOLUTION: A resin composition according to the present disclosure contains a resin and hollow silica particles. The ratio of the median diameter (d50) of the hollow silica particles to d10 thereof is 6.0 or less.SELECTED DRAWING: None 【課題】比誘電率のばらつきが小さいプリプレグ及び硬化物を作製可能な樹脂組成物等の提供。【解決手段】本開示の樹脂組成物は、樹脂及び中空シリカ粒子を含み、中空シリカ粒子のｄ１０に対する、メジアン径（ｄ５０）の比が、６．０以下である。【選択図】なし