SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

• Main Authors: ZHANG SONG, TANAKA YUYA, TSUKAHARA RYUTA
• Format: Patent
• Language: English; Japanese
• Published: 10.06.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a new substrate processing method that can reduce the collapse rate of a pattern in comparison to conventional spin-dry.SOLUTION: A substrate processing method includes: a water repellency agent supply step of supplying water repellency agent-containing liquid to a surface of a substrate W on which a pattern PA is formed; a displacement liquid supply process of replacing the water repellency agent-containing liquid with displacement liquid; a rinse liquid supply process of replacing the displacement liquid with rinse liquid; a heating step of heating the substrate W and the rinse liquid in such a state that the surface of the substrate W is covered by the rinse liquid, to change the rinse liquid from a non-floating state in which the rinse liquid covers the surface of the substrate W in such a state that a recess Q formed on the surface in a pattern PA is filled with the rinse liquid to a floating state in which the rinse liquid covers the surface of the substrate W in such a state that the at least a part of the recess Q is filled with gas; and a drying step of drying the surface of the substrate W by removing the rinse liquid in the floating state from the surface of the substrate W.SELECTED DRAWING: Figure 1A-E 【課題】従来のスピンドライに比べてパターンの倒壊率を低下させることができる新規な基板処理方法を提供する。【解決手段】基板処理方法は、パターンＰＡが形成された基板Ｗの表面に撥水剤含有液を供給する撥水剤供給工程と、撥水剤含有液を置換液に置換する置換液供給工程と、置換液をリンス液に置換するリンス液供給工程と、基板Ｗの表面がリンス液で覆われている状態で基板Ｗおよびリンス液を加熱することにより、パターンＰＡによって表面に形成された凹部Ｑがリンス液で満たされた状態でリンス液が基板Ｗの表面を覆う非浮上状態から、凹部Ｑの少なくとも一部が気体で満たされた状態でリンス液が基板Ｗの表面を覆う浮上状態に、リンス液を変化させる加熱工程と、浮上状態のリンス液を基板Ｗの表面から除去することにより、基板Ｗの表面を乾燥させる乾燥工程とを含む。【選択図】図１Ａ－Ｅ