ELECTRONIC APPARATUS

• Main Authors: YAMADA TAKASHI, ISHIKAWA HIROTAKA, SHODA MASAHIRO, SAITO KENICHI
• Format: Patent
• Language: English; Japanese
• Published: 06.06.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide an electronic apparatus capable of ensuring heat dissipation performance from components on a substrate.SOLUTION: An electronic apparatus 1 includes: a substrate 10 on which a first component 12 and a second component 14 are mounted; a first heat sink 20 that dissipates heat generated by the first component 12; a second heat sink 30 that dissipates heat generated by the second component 14; and a heat conducting portion 40 that conducts heat from the second component 14 to the second heat sink 30. The heat conducting portion 40 has: a heat block 41 that is positioned so as not to overlap the first component 12 and to overlap at least a part of the second component 14 in a plan view; and a heat pipe 42 that connects the heat block 41 and the second heat sink 30. The first heat sink 20 is positioned so as not to overlap the second component 14 and to overlap at least a part of the first component 12 in a plan view. The second heat sink 30 is positioned so as to overlap at least a part of the first heat sink 20 on a side farther from the substrate 10 than the first heat sink 20 in a plan view.SELECTED DRAWING: Figure 1 【課題】基板上の部品からの放熱性能を確保できる電子機器を提供する。【解決手段】電子機器１は、第１部品１２と第２部品１４とが実装されている基板１０と、第１部品１２で生じる熱を放散する第１ヒートシンク２０と、第２部品１４で生じる熱を放散する第２ヒートシンク３０と、第２部品１４から第２ヒートシンク３０に熱を伝導させる熱伝導部４０とを備える。熱伝導部４０は、平面視において第１部品１２に重ならずかつ第２部品１４の少なくとも一部に重なって位置するヒートブロック４１と、ヒートブロック４１と第２ヒートシンク３０とを接続するヒートパイプ４２とを有する。第１ヒートシンク２０は、平面視において第２部品１４に重ならずかつ第１部品１２の少なくとも一部に重なって位置する。第２ヒートシンク３０は、平面視において基板１０から第１ヒートシンク２０よりも遠い側で第１ヒートシンク２０の少なくとも一部に重なって位置する。【選択図】図１