PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: KIM YONG-HOON, KANG SEON HA, LEE SEUNG-EUN
• Format: Patent
• Language: English; Japanese
• Published: 28.05.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a printed circuit board capable of forming microcircuits, and a method for manufacturing the same.SOLUTION: The present invention relates to a printed circuit board and a method for manufacturing the same, comprising a first insulating layer, a plurality of first circuit patterns disposed respectively on the first insulating layer, and a plurality of second circuit patterns disposed respectively on the first insulating layer and thinner than the plurality of first circuit patterns, at least one of the plurality of first circuit patterns and at least one of the plurality of second circuit patterns are repeatedly arranged alternately with each other.SELECTED DRAWING: Figure 3 【課題】本発明の様々な目的の一つは、微細回路の形成が可能なプリント回路基板及びその製造方法を提供することである。【解決手段】本発明は、第１絶縁層と、上記第１絶縁層上にそれぞれ配置された複数の第１回路パターンと、前記第１絶縁層上にそれぞれ配置され、前記複数の第１回路パターンよりも厚さが薄い複数の第２回路パターンと、を含み、上記複数の第１回路パターンのうち少なくとも１つと上記複数の第２回路パターンのうち少なくとも１つとが互いに交互に繰り返し配置される、プリント回路基板及びその製造方法に関する。【選択図】図３