CURABLE RESIN COMPOSITION AND FILM

• Main Author: FUKUDA YUKI
• Format: Patent
• Language: English; Japanese
• Published: 22.05.2024
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a curable resin composition which enables formation of a cured product having high hardness even at a low post bake temperature of 150°C or lower.SOLUTION: A curable resin composition contains an alkali-soluble resin, a polymerizable compound and a polymerization initiator, and has transparency, wherein the polymerizable compound contains a polymerizable compound including an urethane bond.SELECTED DRAWING: None 【課題】ポストベークの温度が１５０℃以下の低温であっても高い硬度を有する硬化物を形成することができる硬化性樹脂組成物を提供する。【解決手段】アルカリ可溶性樹脂と、重合性化合物と、重合開始剤とを含む、透明性を有する硬化性樹脂組成物であって、前記重合性化合物は、ウレタン結合を含む重合性化合物を含有する、硬化性樹脂組成物。【選択図】なし