WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD

• Main Authors: NAGATA HIROYASU, KURODA NOBUHISA
• Format: Patent
• Language: English; Japanese
• Published: 17.05.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide a wiring board which contains inorganic particles and in which haloing of an insulation layer comprising via holes is suppressed, and a manufacturing method of the wiring board.SOLUTION: A wiring board 10 includes: a first insulation layer 15A; a first conductor layer 16A disposed in a part on the first insulation layer; a second insulation layer 15B disposed on the first conductor layer and the first insulation layer, comprising via holes 20 penetrating in a thickness direction in a part on the first conductor layer and formed from an inorganic particle containing resin composition containing a resin component and inorganic particles; a via conductor 18 filling the inside of the via holes and being in contact with the first conductor layer; and an adhesive layer 19 interposed between the second insulation layer and the first conductor layer, adhering the second insulation layer and the first conductor layer, and formed from a resin composition containing the resin component and not containing inorganic particles. The second insulation layer and the adhesive layer are formed using an insulating multilayer sheet.SELECTED DRAWING: Figure 2 【課題】無機粒子を含み、ビア孔を有する絶縁層のハローイングが抑制される配線基板及び配線基板の製造方法を提供する。【解決手段】配線基板１０は、第一絶縁層１５Ａと、前記第一絶縁層上の一部に配置されている第一導体層１６Ａと、前記第一導体層上及び前記第一絶縁層上に配置されており、前記第一導体層上の一部において厚さ方向に貫通するビア孔２０を有し、樹脂成分及び無機粒子を含む無機粒子含有樹脂組成物により形成されている第二絶縁層１５Ｂと、前記ビア孔内に充填されており、前記第一導体層に接触するビア導体１８と、前記第二絶縁層と前記第一導体層との間に介在して前記第二絶縁層と前記第一導体層とを接着し、前記樹脂成分を含み、無機粒子を含まない樹脂組成物により形成されている接着層１９と、を含む。絶縁性積層シートを用いて第二絶縁層と接着層とを形成する。【選択図】図２