SEMICONDUCTOR ELEMENT HAVING STRETCH PROPERTY

To provide a semiconductor device having a stretch property, in which semiconductor device influence for a semiconductor element due to stretch is mitigated and an operation of the semiconductor element can be stabilized.SOLUTION: A semiconductor device comprises: a stretchable stretch property resi...

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Bibliographic Details
Main Authors NAKADA MITSURU, MIYAKAWA MIKIJI, TSUJI HIROSHI
Format Patent
LanguageEnglish
Japanese
Published 16.05.2024
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Summary:To provide a semiconductor device having a stretch property, in which semiconductor device influence for a semiconductor element due to stretch is mitigated and an operation of the semiconductor element can be stabilized.SOLUTION: A semiconductor device comprises: a stretchable stretch property resin substrate 2; a non-stretch property resin substrate 3 that is arranged on a stretch property resin substrate 2; a semiconductor element 4 that is arranged on the non-stretch property resin substrate 3; a first contact part S11 that is provided on a surface side facing the non-stretch property resin substrate 3 of the stretch property resin substrate 2; and a second contact part S12 that is provided on a surface side facing the stretch property resin substrate 2 of the non-stretch property resin substrate 3. The first contact part S11 and the second contact part S12 are provided to slid-ably contact with each other for stretch of the stretch property resin substrate 2 in a state in which these are electrically connected to each other.SELECTED DRAWING: Figure 2 【課題】伸縮による半導体素子への影響を軽減し、半導体素子の動作の安定化を図ることを可能とした伸縮性を有する半導体装置を提供する。【解決手段】伸縮自在な伸縮性樹脂基板2と、伸縮性樹脂基板2の上に配置された非伸縮性樹脂基板3と、非伸縮性樹脂基板3の上に配置された半導体素子4と、伸縮性樹脂基板2の非伸縮性樹脂基板3と対向する面側に設けられた第1の接点部S11と、非伸縮性樹脂基板3の伸縮性樹脂基板2と対向する面側に設けられた第2の接点部S12とを備え、第1の接点部S11と第2の接点部S12とは、互いに電気的に接続された状態で、伸縮性樹脂基板2の伸縮に対して互いに摺接自在に設けられている。【選択図】図2
Bibliography:Application Number: JP20220176418