PASSIVE AND PACKAGED COMPONENT

• Main Authors: YOSHIOKA YOSHIMASA, MIZUNO TAKAAKI, NAKAISO TOSHIYUKI, TOYOSHIMA KENJI
• Format: Patent
• Language: English; Japanese
• Published: 14.05.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; ELECTRICITY; INDUCTANCES; MAGNETS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; TRANSFORMERS

To provide a passive component that can suppress deterioration in performance while alleviating stress during molding.SOLUTION: A passive component includes an inorganic substrate having a first main surface and a second main surface facing each other and containing a semiconductor material, and a passive element portion provided on the first main surface so as to be in contact with the first main surface of the inorganic substrate, and when a cross section in a plane passing through a center of gravity of the entire first main surface and perpendicular to the first main surface is defined as a first cross section, in the first cross section, the inorganic substrate has a first side surface and a second side surface connected to the first main surface and facing each other, and line roughness of the first side surface and line roughness of the second side surface are each larger than line roughness of the first main surface.SELECTED DRAWING: Figure 2 【課題】モールド時の応力を緩和しつつ性能の低下を抑制できる受動部品を提供する。【解決手段】受動部品は、互いに対向する第１主面および第２主面を有し、半導体材料を含む無機基板と、前記無機基板の前記第１主面に接触するように前記第１主面上に設けられた受動素子部とを備え、前記第１主面全体における重心を通過し、前記第１主面に直交する平面における断面を第１断面としたとき、前記第１断面において、前記無機基板は、前記第１主面に接続し互いに対向する第１側面および第２側面を有し、前記第１側面の線粗さおよび前記第２側面の線粗さは、それぞれ、前記第１主面の線粗さよりも大きい。【選択図】図２