SUBSTRATE PROCESSING APPARATUS AND METHOD OF IMPROVING COOLING EFFICIENCY FOR THE SAME

• Main Authors: AHN HEE MAN, PARK CHUN WOO, CHO MINHEE, SONG GYEONG WON, KIM BYUNG HWI, LEE JUMI
• Format: Patent
• Language: English; Japanese
• Published: 07.05.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a substrate processing apparatus capable of shortening a cooling time of a heater.SOLUTION: A substrate processing apparatus for processing a substrate, includes: a support plate 610 that supports the substrate and includes a heater member for heating the substrate; and a cooling unit 660 that forcibly cools the support plate 610. The cooling unit 660 includes: a cooling housing 670 that provides a cooling space; a plurality of gas supply nozzles 680 that are arranged in the cooling housing 670 and supply a cooling gas toward the heater member; and a plurality of gas supply lines that are directory jointed to the gas supply nozzles 680 to supply the cooling gas transmitted from the outside to the gas supply nozzles 680.SELECTED DRAWING: Figure 9 【課題】ヒータの冷却時間を短縮することができる基板処理装置の提供。【解決手段】基板処理装置は、基板を処理する装置であって、基板を支持し、基板を加熱するヒータ部材を含む支持プレート６１０と；支持プレート６１０を強制冷却する冷却ユニット６６０と；を含み、冷却ユニット６６０は、冷却空間を提供する冷却ハウジング６７０と；冷却ハウジング６７０内に配置され、ヒータ部材に向かって冷却ガスを供給する複数のガス供給ノズル６８０と；ガス供給ノズル６８０にダイレクトに連結されて、外部から伝達された冷却ガスをガス供給ノズル６８０に供給する複数のガス供給ラインと；を含む。【選択図】図９