WIRING BOARD

• Main Author: GOTO SHUHEI
• Format: Patent
• Language: English; Japanese
• Published: 07.05.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To relax stress on an insulating layer and suppress the occurrence of cracks.SOLUTION: A wiring board 1 according to an embodiment includes an insulating layer 113, a conductor layer 123 formed on the surface of the insulating layer 113, and a solder resist layer 114 formed on the surface of the insulating layer 113 and on the conductive layer 123. The conductor layer 123 includes a conductor pad P1, the solder resist layer 114 has an opening 114a that exposes the surface of the conductor pad P1 facing away from the insulating layer 113 and the entire side surface of the conductor pad P1, and a first portion 114a1, which is a portion of the inner surface of the opening 114a of the solder resist layer 114 on the insulating layer side, includes a portion at a first angle of 30° or more and 75° or less with respect to the surface exposed to the opening 114a of the insulating layer 113.SELECTED DRAWING: Figure 2 【課題】絶縁層への応力を緩和及びクラックの発生の抑制。【解決手段】実施形態の配線基板１は、絶縁層１１３と、絶縁層１１３の表面上に形成されている導体層１２３と、絶縁層１１３の表面上及び導体層１２３上に形成されているソルダーレジスト層１１４と、を含んでいる。導体層１２３が、導体パッドＰ１を含み、ソルダーレジスト層１１４が、導体パッドＰ１における絶縁層１１３と反対側を向く表面及び導体パッドＰ１の側面全体を露出させる開口１１４ａを有し、ソルダーレジスト層１１４の開口１１４ａの内側面のうちの絶縁層側の部分である第１部分１１４ａ１が、絶縁層１１３の開口１１４ａに露出する表面に対して、３０°以上、７５°以下である第１角度の部分を含んでいる。【選択図】図２