NITRIDE SEMICONDUCTOR DEVICE

To provide a nitride semiconductor device with reduced Ron*Qg.SOLUTION: A nitride semiconductor device 10 includes: an electron transit layer 16; an electron supply layer 18; a gate layer 22 formed of a nitride semiconductor provided on the electron supply layer 18 and containing acceptor impurities...

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Bibliographic Details
Main Author KITO TAKUYA
Format Patent
LanguageEnglish
Japanese
Published 01.05.2024
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Summary:To provide a nitride semiconductor device with reduced Ron*Qg.SOLUTION: A nitride semiconductor device 10 includes: an electron transit layer 16; an electron supply layer 18; a gate layer 22 formed of a nitride semiconductor provided on the electron supply layer 18 and containing acceptor impurities; a gate electrode 24 provided on the gate layer 22; and source electrode 28 and a drain electrode 30 provided on the electron supply layer 18. The gate layer 22 includes first and second gate portions 32, 34 separated from each other separated with a recessed portion 36 interposed therebetween, and a step portion 38 having a thickness thinner than the first and second gate portions 32, 34 and defining a recessed portion 36 between the first and second gate portions 32, 34. The gate electrode 24 includes a first gate electrode portion 52 provided on the first gate portion 32, and a second gate electrode portion 54 provided on the second gate portion 34.SELECTED DRAWING: Figure 1 【課題】Ron・Qgを低減した窒化物半導体装置を提供すること。【解決手段】窒化物半導体装置10は、電子走行層16と、電子供給層18と、電子供給層18上に設けられアクセプタ型不純物を含む窒化物半導体によって構成されたゲート層22と、ゲート層22上に設けられたゲート電極24と、電子供給層18上に設けられたソース電極28およびドレイン電極30とを備える。ゲート層22は、凹部36を隔てて互いに離間した第1および第2ゲート部32,34と、第1および第2ゲート部32,34よりも薄い厚さを有し、第1および第2ゲート部32,34間の凹部36を画定するステップ部38とを含む。ゲート電極24は、第1ゲート部32上に設けられた第1ゲート電極部52と、第2ゲート部34上に設けられた第2ゲート電極部54とを含む。【選択図】図1
Bibliography:Application Number: JP20220166885