SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

• Main Authors: UMENO SHINICHI, ANAMOTO ATSUSHI
• Format: Patent
• Language: English; Japanese
• Published: 25.04.2024
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

To provide a substrate processing apparatus and a substrate processing method that can enhance the cleanliness of a processing liquid supply system.SOLUTION: A substrate processing apparatus includes a storage portion configured to temporarily store a processing liquid for processing a substrate, a replenishment portion configured to replenish the storage portion with the processing liquid, a flow rate measurement portion configured to measure the flow rate of the processing liquid with which the storage portion is refilled, a gas supply portion configured to supply gas to the storage portion and pressurize the inside of the storage portion, and a control portion, and the control portion controls the gas supply portion on the basis of the value measured by the flow rate measurement portion, and executes a process of replenishing the storage portion with the processing liquid from the replenishment portion while adjusting the magnitude of the pressure into the storage portion.SELECTED DRAWING: Figure 3 【課題】本開示は、処理液の供給系の清浄度を高めることが可能な基板処理装置及び基板処理方法を説明する。【解決手段】基板処理装置は、基板を処理する処理液を一時的に貯留するように構成された貯留部と、貯留部に処理液を補充するように構成された補充部と、貯留部に補充される処理液の流量を測定するように構成された流量測定部と、貯留部に気体を供給して貯留部内を加圧するように構成された気体供給部と、制御部とを備える。制御部は、流量測定部によって測定される値に基づいて気体供給部を制御して、貯留部内への圧力の大きさを調整しつつ、処理液を補充部から貯留部に補充する処理を実行するように構成されている。【選択図】図３