SOLID-STATE IMAGING ELEMENT PACKAGE MANUFACTURING METHOD

• Main Authors: KUTSUMIZU MAKOTO, KINOSHITA DAIKI, KURODA KENTA
• Format: Patent
• Language: English; Japanese
• Published: 25.04.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a solid-state imaging element package having high reliability.SOLUTION: A solid-state imaging element package manufacturing method is a method for manufacturing a solid-state imaging element package including a solid-state imaging element having a function part performing imaging, and a margin part surrounding the function part, a frame-like frame arranged in the margin part, and a transparent substrate fixed to the frame so as to cover the function part, and includes the steps of forming the frame having a plurality of resin layers by repeating lamination of a photosensitive resin composition and formation of a resin layer by exposure twice or more, and thereby forming the frame having the plurality of resin layers, and bonding the other of the solid-state imaging element and the transparent substrate to the frame, wherein the step of forming the frame makes an exposure amount immediately after lamination of at least the one resin layer in the plurality of resin layers different from an exposure amount immediately after lamination of the other resin layer in the plurality of resin layers.SELECTED DRAWING: Figure 3 【課題】信頼性が高い固体撮像素子パッケージを提供すること。【解決手段】本発明の一態様に係る固体撮像素子パッケージ製造方法は、撮像を行う機能部および前記機能部を取り囲むマージン部を有する固体撮像素子と、前記マージン部に配設される枠状のフレームと、前記機能部を覆うよう前記フレームに固定される透明基板と、を備える固体撮像素子パッケージを製造する方法であって、前記固体撮像素子および前記透明基板のうちの一方に、感光性樹脂組成物の積層および露光による樹脂層の形成を２回以上繰り返すことにより複数の樹脂層を有する前記フレームを形成する工程と、前記フレームに前記固体撮像素子および前記透明基板の他方を接着する工程と、を備え、前記フレームを形成する工程において、前記複数の樹脂層のうちの少なくとも１つの樹脂層の積層直後の露光量を、前記複数の樹脂層のうちの他の樹脂層の積層直後の露光量と異ならせる。【選択図】図３