SUBSTRATE PROCESSING DEVICE AND SUBSTRATE GRIPPING DEVICE

To provide a technology that improves maintainability of a substrate holder.SOLUTION: A substrate processing device according to an embodiment supplies a processing liquid to the surface of a rotating substrate. The substrate processing device includes a substrate holding portion. The substrate hold...

Full description

Saved in:
Bibliographic Details
Main Authors TOJIMA JIRO, OBARA TOMOAKI, MORI KANTA, OGATA NOBUHIRO, HASHIMOTO YUSUKE, GOTO DAISUKE
Format Patent
LanguageEnglish
Japanese
Published 24.04.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:To provide a technology that improves maintainability of a substrate holder.SOLUTION: A substrate processing device according to an embodiment supplies a processing liquid to the surface of a rotating substrate. The substrate processing device includes a substrate holding portion. The substrate holding portion holds the substrate. The substrate holding portion includes a grip portion and a base portion. The gripping portion contacts the periphery of the substrate and grips the substrate. The grip portion is attached to the base portion.SELECTED DRAWING: Figure 3 【課題】基板保持部のメンテナンス性を向上させる技術を提供する。【解決手段】実施形態に係る基板処理装置は、回転する基板の表面に処理液を供給する。基板処理装置は、基板保持部を備える。基板保持部は、基板を保持する。基板保持部は、把持部と、土台部とを備える。把持部は、基板の周縁に接触し、基板を把持する。土台部は、把持部が取り付けられる。【選択図】図３
Bibliography:Application Number: JP20220163724