LASER PROCESSING DEVICE

• Main Author: OKADA SHIGEFUMI
• Format: Patent
• Language: English; Japanese
• Published: 15.04.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a laser processing device capable of suppressing a processing failure while maintaining high productivity.SOLUTION: The laser processing device comprises: a holding table 10 that holds an object 100 to be processed; a control unit; a laser oscillator 22; a spatial light modulator 24 that includes a display unit 241 for displaying a phase pattern and modulates a laser beam 21 generated by the laser oscillator 22 by the phase pattern; and a collector 23 that collects the laser beam 21 and irradiates the object 100 with it. The control unit stores, beforehand, the phase pattern including a processing pattern for irradiating the object 100 with the laser beam 21 and an unprocessing pattern for non-irradiation, moves the object 100 and a concentration point 211 of the laser beam 21 relative to each other in a process feeding direction and causes the display unit 241 to display the processing pattern and the unprocessing pattern in a switching manner, thereby switching between processing and unprocessing to the object 100 by the laser beam 21.SELECTED DRAWING: Figure 4 【課題】高い生産性を維持しつつ加工不良を抑制することができるレーザー加工装置を提供すること。【解決手段】レーザー加工装置は、被加工物１００を保持する保持テーブル１０と、制御ユニットと、レーザー発振器２２と、位相パターンを表示する表示部２４１を含みレーザー発振器２２により生成されたレーザービーム２１を位相パターンにより変調する空間光変調器２４と、レーザービーム２１を集光して被加工物１００に照射する集光器２３と、を備え、制御ユニットは、被加工物１００に対してレーザービーム２１を照射する加工パターンと、照射しない非加工パターンと、を含む位相パターンを予め記憶し、被加工物１００とレーザービーム２１の集光点２１１とを加工送り方向に相対的に移動させながら加工パターンと非加工パターンとを切り替えて表示部２４１に表示させることで、レーザービーム２１による被加工物１００への加工と非加工とを切り替える。【選択図】図４