RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

• Main Authors: SERA YUSUKE, HATAKEYAMA NENE, FUKUI MASATO, KASUGA KEIICHI, ABE SHINICHIRO
• Format: Patent
• Language: English; Japanese
• Published: 15.04.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

To provide a resin composition that excels in copper foil delamination strength and long-term stability, and a prepreg, a resin film, a laminate, a printed wiring board and a semiconductor package, each comprising the resin composition.SOLUTION: A resin composition comprises (A) a compound comprising two or more vinylbenzyl groups, with molecular weight of 1000 or less, and (B) an azo compound.SELECTED DRAWING: None 【課題】銅箔引きはがし強度、及び、経時安定性に優れる樹脂組成物、並びに、この樹脂組成物を用いたプリプレグ、樹脂フィルム、積層板、プリント配線板及び半導体パッケージを提供する。【解決手段】（Ａ）ビニルベンジル基を２個以上有し、分子量が１０００以下である化合物と、（Ｂ）アゾ化合物とを含む、樹脂組成物。【選択図】なし