LASER WELDING METHOD AND LASER WELDING DEVICE

To obtain, for example, improved novel laser welding method and laser welding device.SOLUTION: A laser welding method, for example, irradiates a processing object surface with a laser beam and relatively scans on the surface, thereby melting the processing object and performing welding. In the laser...

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Main Authors SAKAI TOSHIAKI, KAYAHARA TAKASHI, MATSUMOTO NOBUYASU, YASUOKA TOMOMICHI, SHIGEMATSU TAKASHI
Format Patent
LanguageEnglish
Japanese
Published 11.04.2024
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Summary:To obtain, for example, improved novel laser welding method and laser welding device.SOLUTION: A laser welding method, for example, irradiates a processing object surface with a laser beam and relatively scans on the surface, thereby melting the processing object and performing welding. In the laser welding method, the laser beam includes a plurality of first laser beams which respectively form a spot on the surface, and a second laser beam having a wavelength different from that of the first laser beam. Further, a laser welding device, for example, comprises: a first laser unit which outputs the first laser beam; a second laser unit which outputs the second laser beam having the wavelength different from that of the first laser beam; and an optical head which irradiates the processing object surface with laser beams including the first laser beam from the first laser unit and the second laser beam from the second laser unit. The laser welding device melts a part of the processing object irradiated with the laser beam and performs welding by scanning the laser beam outputted from the optical head on the surface.SELECTED DRAWING: Figure 5 【課題】例えば、改善された新規なレーザ溶接方法およびレーザ溶接装置を得る。【解決手段】レーザ溶接方法は、例えば、レーザ光を加工対象の表面に照射するとともに当該表面上で相対的に走査することにより、当該加工対象を溶融して溶接を行う、レーザ溶接方法であって、レーザ光は、それぞれ表面上にスポットを形成する複数の第一レーザ光と、当該第一レーザ光とは異なる波長の第二レーザ光と、を含む。また、レーザ溶接装置は、例えば、第一レーザ光を出力する第一レーザ装置と、第一レーザ光とは異なる波長の第二レーザ光を出力する第二レーザ装置と、第一レーザ装置からの第一レーザ光および第二レーザ装置からの第二レーザ光を含むレーザ光を加工対象の表面に照射する光学ヘッドと、を備え、光学ヘッドから出力されたレーザ光を表面上で走査することにより、加工対象のレーザ光が照射された部分を溶融して溶接を行う。【選択図】図5
Bibliography:Application Number: JP20220158856