THERMOSETTING RESIN COMPOSITION, RESIN SHEET, THERMALLY CONDUCTIVE MEMBER, METAL BASE SUBSTRATE, AND ELECTRONIC DEVICE

• Main Authors: OBA AKIYOSHI, KASHINO TOMOMASA
• Format: Patent
• Language: English; Japanese
• Published: 11.04.2024
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

To provide a thermosetting resin composition improved in balance between thermal conductivity and heat resistance, a resin sheet, a thermally conductive member, a metal base substrate, and an electronic device.SOLUTION: The thermosetting resin composition contains an epoxy resin (A), a curing agent (B), and a thermally conductive filler (C). The epoxy resin (A) contains an epoxy resin (A1) having a trihydroxyphenylbenzene skeleton. The curing agent (B) contains one or more selected from the group consisting of cyanate ester resins (B1) and imidazole compounds (B2).SELECTED DRAWING: Figure 1 【課題】熱伝導性及び耐熱性のバランスが向上した熱硬化性樹脂組成物、樹脂シート、熱伝導性部材、金属ベース基板及び電子装置を提供する。【解決手段】エポキシ樹脂（Ａ）と、硬化剤（Ｂ）と、熱伝導性フィラー（Ｃ）と、を含有し、前記エポキシ樹脂（Ａ）が、トリヒドロキシフェニルベンゼン骨格を有するエポキシ樹脂（Ａ１）を含み、前記硬化剤（Ｂ）が、シアネートエステル樹脂（Ｂ１）及びイミダゾール化合物（Ｂ２）からなる群から選択される一種または二種以上を含む、熱硬化性樹脂組成物。【選択図】図１