RESIN CASE, SENSOR MODULE, MANUFACTURING METHOD OF RESIN CASE, AND MANUFACTURING METHOD OF SENSOR MODULE

• Main Authors: SUGIMOTO CHIAKI, TOYAMA YUICHI
• Format: Patent
• Language: English; Japanese
• Published: 11.04.2024
• Subjects: MEASURING; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE; PHYSICS; TESTING

To provide a resin case having high waterproofness, a sensor module, a manufacturing method of a resin case, and a manufacturing method of a sensor module.SOLUTION: A resin case 10 includes a resin case body 2 and a lid body 3, and a cut-off member 4 arranged between the case body 2 and the lid body 3. The melting point of the cut-off member 4 is lower than the melting points of the case body 2 and the lid body 3, and the cut-off member 4 is mixed with the case body 2 and the lid body 3. A sensor module 1 includes a resin case 10, a magnetic field sensor 11 stored in the resin case 10, and a cable 13 for collectively storing a plurality of electric wires 131 electrically connected to the magnetic field sensor 11 in a sheath 132, and the sheath 132 and the lid body 3 are mixed with each other. The cut-off member 4 and the case body 2 are mixed with each other by molding heat of the resin in a step of molding the case body 2, and the cut-off member 4, the sheath 132 and the lid body 3 are mixed with each other by molding heat of the resin in a step of molding the lid body 3.SELECTED DRAWING: Figure 4 【課題】高い防水性を有する樹脂ケース、センサモジュール、樹脂ケースの製造方法、及びセンサモジュールの製造方法を提供する。【解決手段】樹脂ケース１０は、樹脂製のケース本体２及び蓋体３と、ケース本体２と蓋体３との間に配置された止水部材４とを備える。止水部材４の融点は、ケース本体２及び蓋体３の融点よりも低く、止水部材４がケース本体２及び蓋体３と溶け合っている。センサモジュール１は、樹脂ケース１０と、樹脂ケース１０に収容された磁界センサ１１と、磁界センサ１１に電気的に接続された複数の電線１３１を一括してシース１３２に収容してなるケーブル１３とを備え、シース１３２と蓋体３とが溶け合っている。止水部材４とケース本体２とは、ケース本体２を成形する工程における樹脂の成形熱によって溶け合い、止水部材４及びシース１３２と蓋体３とは、蓋体３を成形する工程における樹脂の成形熱によって溶け合う。【選択図】図４