RESIN LAMINATE, METAL-CLAD LAMINATE AND CIRCUIT BOARD
To achieve both of excellent dielectric property and flame retardancy in a resin laminate using aliphatic thermoplastic resin.SOLUTION: Disclosed is a resin laminate in which a first insulation resin layer, an adhesion layer and a second insulation resin layer are laminated in this order. In the res...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English Japanese |
Published |
11.04.2024
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | To achieve both of excellent dielectric property and flame retardancy in a resin laminate using aliphatic thermoplastic resin.SOLUTION: Disclosed is a resin laminate in which a first insulation resin layer, an adhesion layer and a second insulation resin layer are laminated in this order. In the resin laminate, total thickness T1 is in a range of 70 to 500 μm, and an adhesion layer thickness T2 is more than 50 μm. The VTM burning time t in a vertical flame test of UL94 thin material is 10 sec. or less, and the flame retardancy parameter x represented by x=A/[B+(2×C)+D+(2×E)] is in the range of more than 0 but 2.4 or less. In the above formula, A is a total amount of aliphatic skeleton derived from dimer acid type diamine in the adhesion layer; B is a total amount of phenyl skeleton in the thickness range from the border between the skeleton and the adhesion layer to 2.5 μm, respectively toward the first and second insulation resin layer sides; C is a total amount of biphenyl skeleton in the same thickness range; D is a total amount of phenyl skeleton in the adhesion layer; E is a total amount of biphenyl skeleton in the adhesion layer; and units are [g], respectively.SELECTED DRAWING: Figure 1
【課題】脂肪族系熱可塑性樹脂を使用した樹脂積層体において、優れた誘電特性と難燃性との両立を図る。【解決手段】第1の絶縁樹脂層と接着層と第2の絶縁樹脂層とがこの順に積層されている樹脂積層体であって、合計厚みT1が70~500μmの範囲内であり、かつ、接着層の厚みT2が50μmより大きく、UL94薄手材料垂直燃焼試験におけるVTM燃焼時間tが10秒以下であり、下記式で表される難燃性パラメータxが0を超え2.4以下の範囲内である。x=A/[B+(2×C)+D+(2×E)]であり、A:接着層中のダイマー酸型ジアミン由来の脂肪族骨格の合計量、B:接着層との境界から第1及び第2の絶縁樹脂層側へそれぞれ2.5μmまでの厚み範囲のフェニル骨格の合計量、C:同厚み範囲のビフェニル骨格の合計量、D:接着層中のフェニル骨格の合計量、E:接着層中のビフェニル骨格の合計量を意味し、単位はそれぞれ[g]である。【選択図】図1 |
---|---|
Bibliography: | Application Number: JP20220157820 |