RESIN COMPOSITION, PREPREG, RESIN FILM, METALLIC FOIL WITH RESIN, LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

• Main Authors: MURATA YUTA, KAKIYA MINORU, TAKEGUCHI AYAKA, SATO NAOYOSHI, FUKUI MASATO, AKEBI RYUJI, TANIGAWA TAKAO
• Format: Patent
• Language: English; Japanese
• Published: 09.04.2024
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

To provide a resin composition which is excellent in such dielectric characteristics (high frequency characteristics) as to reduce transmission loss of a high frequency signal, and can exhibit high adhesion to a conductor under ordinary temperature and high adhesion to a conductor after having been exposed to high temperature, and to provide a prepreg, a resin film, a metallic foil with a resin, a laminate, a printed wiring board, and a semiconductor package, which can be obtained using the resin composition.SOLUTION: A resin composition contains (A) a maleimide compound and (B) a conjugated diene polymer which is not maleimide-modified.SELECTED DRAWING: None 【課題】高周波信号の伝送損失を低減できる誘電特性（高周波特性）に優れ、且つ、常温下での導体との高い接着性及び高温下に晒された後における導体との高い接着性を発現し得る樹脂組成物を提供すること、並びに、当該樹脂組成物を用いて得られる、プリプレグ、樹脂フィルム、樹脂付き金属箔、積層板、プリント配線板、及び半導体パッケージを提供すること。【解決手段】（Ａ）マレイミド化合物と、（Ｂ）マレイミド変性されていない共役ジエンポリマーと、を含有する樹脂組成物。【選択図】なし