POLISHING PAD, POLISHING PAD MANUFACTURING METHOD, AND METHOD FOR POLISHING SURFACE OF OPTICAL MATERIAL OR OF SEMICONDUCTOR MATERIAL

To provide a polishing pad that can exert a high polishing rate and is excellent in topography performance.SOLUTION: The polishing pad has a polishing layer, where the polishing layer includes polyurethane resin and porous fine particles, and has air bubble in a nearly tear shape.SELECTED DRAWING: F...

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Main Authors TATENO TEPPEI, TAKAMIZAWA YAMATO, OCHI KEISUKE, KAWASAKI TETSUAKI
Format Patent
LanguageEnglish
Japanese
Published 08.04.2024
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:To provide a polishing pad that can exert a high polishing rate and is excellent in topography performance.SOLUTION: The polishing pad has a polishing layer, where the polishing layer includes polyurethane resin and porous fine particles, and has air bubble in a nearly tear shape.SELECTED DRAWING: Figure 1 【課題】高い研磨レートを示し、かつトポグラフィー性能に優れる研磨パッドを提供することを目的とする。【解決手段】研磨層を有する研磨パッドであって、前記研磨層は、ポリウレタン樹脂及び多孔質微粒子を含み、略涙形状の気泡を有する、前記研磨パッド。【選択図】図１
Bibliography:Application Number: JP20220153772