RESIN COMPOSITION, RESIN SHEET, SECURITY CARD, AND METHOD FOR PRODUCING RESIN COMPOSITION

To provide a resin composition in which an antistatic agent is thoroughly dispersed in a thermoplastic resin and which has low surface resistivity, a resin sheet formed from the resin composition, a security card, and a method for producing a resin composition.SOLUTION: A resin composition includes...

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Bibliographic Details
Main Authors SUZUKI KENTARO, WAKAYAMA SHOTA, TAKEDA KIYOHIDE
Format Patent
LanguageEnglish
Japanese
Published 02.04.2024
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Summary:To provide a resin composition in which an antistatic agent is thoroughly dispersed in a thermoplastic resin and which has low surface resistivity, a resin sheet formed from the resin composition, a security card, and a method for producing a resin composition.SOLUTION: A resin composition includes a thermoplastic resin (A) and an antistatic agent (B), wherein the thermoplastic resin (A) includes at least one of polycarbonate resin and amorphous polyester resin, and the antistatic agent (B) is a compound represented by formula (1). Formula (1): [(R1)3R2P]+ (R3SO2)(R4SO2)N-, R1 and R2 each independently represent a C5 or higher alkyl group, and R3 and R4 each independently represent a C1-4 perfluoroalkyl group.SELECTED DRAWING: None 【課題】帯電防止剤が熱可塑性樹脂中に十分に分散しており、かつ、表面抵抗率が低い樹脂組成物、ならびに、前記樹脂組成物から形成された樹脂シート、セキュリティカードおよび樹脂組成物の製造方法の提供。【解決手段】熱可塑性樹脂(A)および帯電防止剤(B)を含み、前記熱可塑性樹脂(A)がポリカーボネート樹脂および非晶性ポリエステル樹脂の少なくとも1種を含み、前記帯電防止剤(B)が下記式(1)で表される化合物である、樹脂組成物;[(R1)3R2P]+・(R3SO2)(R4SO2)N-(1)式(1)中、R1およびR2は、それぞれ独立に、炭素数5以上のアルキル基を表し、R3およびR4は、それぞれ独立に、炭素数1~4のパーフルオロアルキル基を表す。【選択図】なし
Bibliography:Application Number: JP20240002592