RESVERATROL EPOXY RESIN, THERMOSETTING RESIN COMPOSITION, RESIN SHEET, THERMALLY CONDUCTIVE MEMBER, METAL BASE SUBSTRATE, AND ELECTRONIC APPARATUS

To provide a resveratrol epoxy resin, a thermosetting resin composition and a resin sheet which can achieve a thermally conductive member with improved balance between thermal conductivity and thermal resistance, as well as a thermally conductive member, a metal base substrate, and an electronic app...

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Bibliographic Details
Main Authors OBA AKIYOSHI, KASHINO TOMOMASA
Format Patent
LanguageEnglish
Japanese
Published 29.03.2024
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Summary:To provide a resveratrol epoxy resin, a thermosetting resin composition and a resin sheet which can achieve a thermally conductive member with improved balance between thermal conductivity and thermal resistance, as well as a thermally conductive member, a metal base substrate, and an electronic apparatus with improved balance between thermal conductivity and thermal resistance.SOLUTION: The present invention provides a resveratrol epoxy resin derived from a resveratrol compound, an aromatic diol compound and an epoxy compound, or a resveratrol epoxy resin having a resveratrol compound-derived structural unit A and an aromatic diol compound-derived structural unit B.SELECTED DRAWING: Figure 1 【課題】熱伝導性および耐熱性のバランスが向上した熱伝導性部材を実現できるレスベラトロール型エポキシ樹脂、熱硬化性樹脂組成物および樹脂シート、並びに、熱伝導性および耐熱性のバランスが向上した熱伝導性部材、金属ベース基板、および電子装置を提供する。【解決手段】レスベラトロール化合物、芳香族ジオール化合物およびエポキシ化合物から誘導されたレスベラトロール型エポキシ樹脂、または、レスベラトロール化合物由来の構造単位Aおよび芳香族ジオール化合物由来の構造単位Bを有するレスベラトロール型エポキシ樹脂である。【選択図】図1
Bibliography:Application Number: JP20220148394