MANUFACTURING METHOD FOR ELECTRONIC COMPONENT

• Main Authors: YAZAWA KOSUKE, ISOMAE YUTO, YAMAMOTO MASATSUGU
• Format: Patent
• Language: English; Japanese
• Published: 28.03.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; ELECTRICITY; RESISTORS

To provide a manufacturing method for an electronic component, in which the deterioration in electric characteristic can be suppressed.SOLUTION: A manufacturing method for an electronic component includes: preparing a plurality of electronic component main bodies each having an element assembly and a pair of external electrodes facing each other in a first direction on the element assembly; preparing a pair of metal terminals; performing solder bonding between each of the pair of metal terminals and the corresponding external electrode out of the pair of external electrodes of the electronic component main bodies by using a flux and heating a solder in a state where the electronic component main bodies are arranged so that the element assemblies of the electronic component main bodies are adjacent to each other in a second direction that intersects with the first direction; and removing the flux existing between the element assemblies of the electronic component main bodies when the solder bonding is performed.SELECTED DRAWING: Figure 4 【課題】電気的特性の劣化を抑制し得る電子部品の製造方法を提供する。【解決手段】電子部品の製造方法は、素体と、素体上で第一方向で互いに対向している一対の外部電極と、をそれぞれ有する複数の電子部品本体を準備することと、一対の金属端子を準備することと、複数の電子部品本体が有する素体が第一方向と交差する第二方向で互いに隣り合うように複数の電子部品本体を並べた状態で、フラックスを用い、かつ、はんだを加熱して、一対の金属端子のそれぞれと、複数の電子部品本体それぞれの一対の外部電極のうち、対応する外部電極とのはんだ接合を行うことと、はんだ接合を行うときに、複数の電子部品本体が有する素体の間に存在するフラックスを除去すること、を含む。【選択図】図４