SEMICONDUCTOR DEVICE

• Main Authors: ARAI MASATOSHI, MATSUO KAZUKI, IZUMISAWA MASARU
• Format: Patent
• Language: English; Japanese
• Published: 27.03.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a semiconductor device having a wide safe operation region.SOLUTION: A semiconductor device comprises a base member, a semiconductor chip, and a first conductive member. The base member has a first surface and a second surface opposite to the first surface, and includes a convex part provided on the second surface side. The semiconductor chip is mounted on the second surface via a first connection member. The semiconductor chip has a first electrode, a second electrode, a control pad, and a semiconductor part. The semiconductor part is located between the first electrode and the second electrode and between the first electrode and the control pad. The first connection member is connected with the first electrode. The control pad is provided so as to be separated from the second electrode. The first conductive member is bonded on the second electrode via a second connection member. The convex part of the base member is located below a lateral surface along a space between the second electrode of the second connection member and the control pad.SELECTED DRAWING: Figure 1 【課題】広い安全動作領域を有する半導体装置を提供する。【解決手段】半導体装置は、ベース部材と、半導体チップと、第１導電部材と、を備える。前記ベース部材は、第１面と、前記第１面とは反対側の第２面と、を有し、前記第２面側に設けられる凸部を含む。前記半導体チップは、前記第２面上に第１接続部材を介してマウントされる。前記半導体チップは、第１電極と、第２電極と、制御パッドと、半導体部と、を有し、前記半導体部は、前記第１電極と前記第２電極との間、および、前記第１電極と前記制御パッドとの間に位置する。前記第１接続部材は、前記第１電極に接続され、前記制御パッドは、前記第２電極から離間して設けられる。前記第１導電部材は、第２接続部材を介して前記第２電極上にボンディングされる。前記ベース部材の前記凸部は、前記第２接続部材の前記第２電極と前記制御パッドとの間のスペースに沿った側面の下方に位置する。【選択図】図１