POLISHING PAD AND MANUFACTURING METHOD OF THE SAME

To provide a polishing pad which enables improvement of end part sagging without changing physical properties and a cell structure of a polishing layer largely.SOLUTION: A polishing pad includes: a polishing layer having a polishing surface for polishing an object to be polished; and a base material...

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Bibliographic Details
Main Authors TATENO TEPPEI, TAKAMIZAWA YAMATO, OCHI KEISUKE, KAWASAKI TETSUAKI
Format Patent
LanguageEnglish
Japanese
Published 22.03.2024
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:To provide a polishing pad which enables improvement of end part sagging without changing physical properties and a cell structure of a polishing layer largely.SOLUTION: A polishing pad includes: a polishing layer having a polishing surface for polishing an object to be polished; and a base material layer disposed at the opposite side of the polishing surface of the polishing layer. The base material layer is formed by a closed-cell polyurethane foam compression body having a compressive modulus ranging from one tenth to one thirtieth.SELECTED DRAWING: Figure 6 【課題】研磨層の物性・気泡構造を大きく変更することなく、端部ダレの改善を可能とする研磨パッドを提供することを目的とする。【解決手段】被研磨物を研磨加工するための研磨面を有する研磨層と、前記研磨層の研磨面と反対側に配置される基材層と、を備える研磨パッドであって、前記基材層は、圧縮倍率１／１０～１／３０の独立発泡ポリウレタンフォーム圧縮体から構成される、研磨パッド。【選択図】図６
Bibliography:Application Number: JP20220143640