PROBE HEAD, ELECTRICAL CONNECTING DEVICE, AND METHOD FOR MANUFACTURING PROBE HEAD

• Main Authors: KONO SHO, TOKUMARU KOICHIRO
• Format: Patent
• Language: English; Japanese
• Published: 21.03.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

To provide a probe head, an electrical connecting device, and a method for manufacturing the probe head with which it is possible to suppress warping of a guide plate of the probe head.SOLUTION: A probe head 20 comprises a top guide plate 211, a bottom guide plate 212, and a middle guide plate 213 where a first recess 201 is formed on at least one first plane and a second recess 202 is formed on a second plane. A guide region where a guide hole for a probe to pass through is formed, is defined to the first recess 201 and the second recess 202. The probe head 20 has a structure such that the top guide plate 211, the bottom guide plate 212, and the middle guide plate 213 are arranged in multiple stages so that the guide regions overlap via a hollow section.SELECTED DRAWING: Figure 1 【課題】プローブヘッドのガイド板の反りを抑制できるプローブヘッド、電気的接続装置およびプローブヘッドの製造方法を提供する。【解決手段】プローブヘッド２０は、少なくともいずれかの第１面に第１凹部２０１、第２面に第２凹部２０２が形成されたトップガイド板２１１、ボトムガイド板２１２、ミドルガイド板２１３を有する。プローブが通過するためのガイド穴が形成されたガイド領域が、第１凹部２０１と第２凹部２０２に定義されている。プローブヘッド２０は、ガイド領域が中空部分を介して重なるように、トップガイド板２１１、ボトムガイド板２１２、ミドルガイド板２１３が多段に配置された構成を有する。【選択図】図１