RESIN MATERIAL AND MULTILAYER PRINTED WIRING BOARD

• Main Authors: BABA SUSUMU, KAWAHARA YUKO, HAYASHI TATSUJI, KUBO AKIKO
• Format: Patent
• Language: English; Japanese
• Published: 15.03.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a resin material capable of suppressing warpage of a cured material and shortening a baking time.SOLUTION: A resin material according to the invention contains: a thermosetting compound that does not have an aromatic ring in a structural portion excluding a thermosetting functional group, has two or more CH3 terminals in the structural portion excluding the thermosetting functional group, and satisfies a following formula (X); and inorganic filler. A content of the inorganic filler in 100 wt.% of the resin material excluding a solvent therein is 30 wt.% or more. 0.1≤A/(B×C)≤0.6...formula (X), A: number of CH3 terminals of the structural portion excluding the thermosetting functional group of the thermosetting compound, B: number of the thermosetting functional groups of the thermosetting compound, and C: number of carbon atoms of the structural portion excluding the thermosetting functional group of the thermosetting compound.SELECTED DRAWING: Figure 1 【課題】硬化物の反りを抑えることができ、かつベーキング時間を短くすることができる樹脂材料を提供する。【解決手段】本発明に係る樹脂材料は、熱硬化性官能基を除く構造部分において芳香族環を有さず、熱硬化性官能基を除く構造部分において２個以上のＣＨ３末端を有し、かつ下記式（Ｘ）を満足する熱硬化性化合物と、無機充填材とを含み、樹脂材料中の溶剤を除く成分１００重量％中、前記無機充填材の含有量が３０重量％以上である。０．１≦Ａ／（Ｂ×Ｃ）≦０．６ ・・・式（Ｘ）Ａ：前記熱硬化性化合物の熱硬化性官能基を除く構造部分が有するＣＨ３末端の個数Ｂ：前記熱硬化性化合物が有する熱硬化性官能基の個数Ｃ：前記熱硬化性化合物の熱硬化性官能基を除く構造部分が有する炭素原子の個数【選択図】図１