QUANTUM DEVICE

• Main Authors: KIKUCHI MASARU, ISHIHARA KUNIHIKO, WATANABE HIDE
• Format: Patent
• Language: English; Japanese
• Published: 14.03.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CURRENT COLLECTORS; ELECTRICITY; LINE CONNECTORS

To provide secure connection reliability and signal quality of a quantum device which uses probe pins to make a connection between substrates.SOLUTION: A quantum device comprises: a quantum chip which comprises a superconducting quantum circuit; an interposer which has a wiring layer on a first surface of a substrate and a wiring layer on a second surface on the opposite side from the first surface, the quantum chip being mounted on the wiring layer on the first surface; a housing which houses a plurality of probe pins, each having one end in contact with a plurality of terminals of the wiring layer on the second surface of the interposer, in a plurality of openings penetrating the second surface on the opposite side from the first surface from the first surface opposed to the second surface of the interposer; a board which has a wiring layer, including terminals in contact with other ends of the plurality of probe pins, on the first surface opposed to the second surface of the housing, and connects signals from the second surface side to the outside; and at least one spacer which secures a clearance between the first surface of the housing and the second surface of the interposer opposed to the first surface of the housing between the first surface of the housing and the second surface of the interposer.SELECTED DRAWING: Figure 1A 【課題】プローブピンを用いて基板間の接続を行う量子デバイスの接続信頼性と信号品質を確保する。【解決手段】量子デバイスは、超伝導量子回路を備えた量子チップと、基板の第１面の配線層と、第１面と反対側の第２面の配線層とを有し、量子チップを第１面の配線層に実装するインターポーザと、インターポーザの第２面に対向する第１面から、第１面と反対側の第２面を貫通する複数の開口に、インターポーザの第２面の配線層の複数の端子と一端が接触する複数のプローブピンを収容したハウジングと、ハウジングの第２面に対向する第１面に、複数のプローブピンの他端と接触する端子を含む配線層を有し、第２面側から信号を外部に接続するボードと、ハウジングの第１面とインターポーザの第２面との間に、ハウジングの第１面と、ハウジングの第１面に対向するインターポーザの第２面との間のクリアランスを確保する、少なくとも一つのスペーサを備えている。【選択図】図１Ａ