SEMICONDUCTOR STORAGE DEVICE
To suppress a decrease in reliability of a semiconductor storage device.SOLUTION: A semiconductor storage device comprises: a first oxide semiconductor layer extending in a first direction; a second oxide semiconductor layer extending in the first direction and arranged adjacent to the first oxide s...
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Main Authors | , , , |
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Format | Patent |
Language | English Japanese |
Published |
07.03.2024
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Subjects | |
Online Access | Get full text |
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Summary: | To suppress a decrease in reliability of a semiconductor storage device.SOLUTION: A semiconductor storage device comprises: a first oxide semiconductor layer extending in a first direction; a second oxide semiconductor layer extending in the first direction and arranged adjacent to the first oxide semiconductor layer along a second direction crossing the first direction; a first wiring extending in a third direction crossing the first direction and overlapping the first oxide semiconductor layer in the third direction; a second wiring extending in the third direction and overlapping the second oxide semiconductor layer in the third direction; a first insulation film provided between the first wiring and the first oxide semiconductor layer; a second insulation film provided between the second wiring and the second oxide semiconductor layer; a first conductor provided on the first oxide semiconductor layer; a second conductor provided on the second oxide semiconductor layer; and an insulation layer including a gap between the first conductor and the second conductor or between the first wiring and the second wiring.SELECTED DRAWING: Figure 6
【課題】半導体記憶装置の信頼性の低下を抑制する【解決手段】半導体記憶装置は、第1方向に延在する第1の酸化物半導体層と、第1方向に延在し、第1方向と交差する第2方向に沿って第1の酸化物半導体層に隣り合って配置された第2の酸化物半導体層と、第1方向と交差する第3方向に延在し、第3方向において第1の酸化物半導体層に重なる第1の配線と、第3方向に延在し、第3方向において第2の酸化物半導体層に重なる第2の配線と、第1の配線と第1の酸化物半導体層との間に設けられた第1の絶縁膜と、第2の配線と第2の酸化物半導体層との間に設けられた第2の絶縁膜と、第1の酸化物半導体層の上に設けられた第1の導電体と、第2の酸化物半導体層の上に設けられた第2の導電体と、第1の導電体と第2の導電体との間、または、第1の配線と第2の配線との間に空隙を有する絶縁層と、を具備する。【選択図】図6 |
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Bibliography: | Application Number: JP20220134851 |