SUBSTRATE FIXING APPARATUS AND MANUFACTURING METHOD OF SUBSTRATE FIXING APPARATUS

• Main Author: KUSAMA YASUHIKO
• Format: Patent
• Language: English; Japanese
• Published: 07.03.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

To provide a substrate fixing apparatus which can improve uniformity of a temperature on a substrate mounting surface.SOLUTION: A substrate fixing apparatus 10 has: a base plate 20 having a first adhesive surface 20A; an electrostatic chuck 30 which has a substrate mounting surface 31A on which a substrate W is mounted and a second adhesive surface 31B provided on a side opposite to the substrate mounting surface 31A, and adsorbs and holds the substrate W; and an adhesive layer 50 for bonding the first adhesive surface 20A of the base plate 20 and the second adhesive surface 31B of the electrostatic chuck 30. The electrostatic chuck 30 has: a recess 35 provided on the second adhesive surface 31B; an electronic component 34 stored in the recess 35; and a resin layer 40 having a filling part 41 filling the recess 35, and a projection part 42 which projects from the recess 35 and has a tip in contact with the first adhesive surface 20A. The projection part 42 is formed so as to be continuous to and integral with the filling part 41.SELECTED DRAWING: Figure 1 【課題】基板載置面における温度の均一性を向上できる基板固定装置を提供する。【解決手段】基板固定装置１０は、第１接着面２０Ａを有するベースプレート２０と、基板Ｗが載置される基板載置面３１Ａと、基板載置面３１Ａと反対側に設けられた第２接着面３１Ｂとを有し、基板Ｗを吸着保持する静電チャック３０と、ベースプレート２０の第１接着面２０Ａと静電チャック３０の第２接着面３１Ｂとを接着する接着層５０とを有する。静電チャック３０は、第２接着面３１Ｂに設けられた凹部３５と、凹部３５に収容された電子部品３４と、凹部３５を充填する充填部４１と凹部３５から突出するとともに先端が第１接着面２０Ａに接触する突出部４２とを有する樹脂層４０とを有する。突出部４２は、充填部４１と連続して一体に形成されている。【選択図】図１