MANUFACTURING METHOD OF PRINTED WIRING BOARD

• Main Authors: ONO MOTOJI, ARAI KANJI
• Format: Patent
• Language: English; Japanese
• Published: 07.03.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide a manufacturing method of a printed wiring board which can form a conductor in an inner surface of a hole in a state where a residue is reduced, by a process that does not give a damage to a substrate, is low cost and simple, and does not require plasma treatment.SOLUTION: A manufacturing...