MANUFACTURING METHOD OF PRINTED WIRING BOARD

• Main Authors: ONO MOTOJI, ARAI KANJI
• Format: Patent
• Language: English; Japanese
• Published: 07.03.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide a manufacturing method of a printed wiring board which can form a conductor in an inner surface of a hole in a state where a residue is reduced, by a process that does not give a damage to a substrate, is low cost and simple, and does not require plasma treatment.SOLUTION: A manufacturing method of a printed wiring board includes: preparing a substrate with a metal layer which has a substrate containing a fluorine resin and an inorganic filler, and a metal layer formed on at least one main surface of the substrate, and has a water contact angle of the main surface of the substrate where the metal layer is formed of 75° or less; forming a hole on the substrate with the metal layer under a drilling condition where a drill diameter (mm)×drill rotation number (rpm) is 16,000-57,000 (mm rpm); cleaning the inner surface of the formed hole; and forming a conductor on the cleaned inner surface of the hole.SELECTED DRAWING: Figure 5 【課題】基板にダメージを与えることのない低コストで簡単なプラズマ処理なしのプロセスにより、残渣が低減した状態で孔の内表面に導体を形成できるプリント配線板の製造方法の提供。【解決手段】フッ素樹脂と無機フィラーとを含む基板と、前記基板の少なくとも一方の主面上に形成された金属層とを有しており、前記金属層が形成される前記基板の主面の水接触角が７５°以下である金属層付き基板を準備し、ドリル径（ｍｍ）×ドリル回転数（ｒｐｍ）が１６０００～５７０００（ｍｍ・ｒｐｍ）であるドリル加工条件で、前記金属層付き基板に孔を形成し、前記形成された孔の内表面を洗浄し、前記洗浄された孔の内表面に導体を形成する、プリント配線板の製造方法。【選択図】図５