ULTRASONIC PROBE
To guide heat generated in an electronic circuit or the like to a heat absorption member while dispersing in a backing member, in an ultrasonic probe.SOLUTION: A backing member is provided on the rear side of an electronic circuit 37. The backing member comprises a sub-backing 21 with first thermal...
Saved in:
Main Authors | , , , , , |
---|---|
Format | Patent |
Language | English Japanese |
Published |
06.03.2024
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | To guide heat generated in an electronic circuit or the like to a heat absorption member while dispersing in a backing member, in an ultrasonic probe.SOLUTION: A backing member is provided on the rear side of an electronic circuit 37. The backing member comprises a sub-backing 21 with first thermal anisotropy and a main backing 22 with second thermal anisotropy different from the first thermal anisotropy. The sub-backing 21 exhibits a heat diffusion action in a direction X. The main backing 22 exhibits a heat diffusion action in a direction Y.SELECTED DRAWING: Figure 2
【課題】超音波プローブにおいて、電子回路等で生じた熱を、バッキング部材内で拡散させながら、吸熱部材へ導く。【解決手段】電子回路37の後側にバッキング部材が設けられている。バッキング部材は、第1の熱的異方性を有する副バッキング21、及び、第1の熱的異方性とは異なる第2の熱的異方性を有する主バッキング22からなる。副バッキング21は、X方向への熱拡散作用を発揮する。主バッキング22は、Y方向への熱伝達作用を発揮する。【選択図】図2 |
---|---|
Bibliography: | Application Number: JP20220131778 |