ULTRASONIC PROBE

To guide heat generated in an electronic circuit or the like to a heat absorption member while dispersing in a backing member, in an ultrasonic probe.SOLUTION: A backing member is provided on the rear side of an electronic circuit 37. The backing member comprises a sub-backing 21 with first thermal...

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Main Authors SAWADA KO, SHIRAISHI TOMOHIRO, KATSURA HIDETSUGU, HATTORI HIROSHI, SHIMADA SACHIYO, IWASHITA TAKAYUKI
Format Patent
LanguageEnglish
Japanese
Published 06.03.2024
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Summary:To guide heat generated in an electronic circuit or the like to a heat absorption member while dispersing in a backing member, in an ultrasonic probe.SOLUTION: A backing member is provided on the rear side of an electronic circuit 37. The backing member comprises a sub-backing 21 with first thermal anisotropy and a main backing 22 with second thermal anisotropy different from the first thermal anisotropy. The sub-backing 21 exhibits a heat diffusion action in a direction X. The main backing 22 exhibits a heat diffusion action in a direction Y.SELECTED DRAWING: Figure 2 【課題】超音波プローブにおいて、電子回路等で生じた熱を、バッキング部材内で拡散させながら、吸熱部材へ導く。【解決手段】電子回路37の後側にバッキング部材が設けられている。バッキング部材は、第1の熱的異方性を有する副バッキング21、及び、第1の熱的異方性とは異なる第2の熱的異方性を有する主バッキング22からなる。副バッキング21は、X方向への熱拡散作用を発揮する。主バッキング22は、Y方向への熱伝達作用を発揮する。【選択図】図2
Bibliography:Application Number: JP20220131778