ULTRASONIC PROBE

To efficiently guide heat generated in an electronic circuit to a heat absorption member via a backing, in an ultrasonic probe.SOLUTION: A sub-backing 21 with first thermal anisotropy is provided on the rear side of an electronic circuit 37. A main backing 22 with second thermal anisotropy different...

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Main Authors SAWADA KO, SHIRAISHI TOMOHIRO, KATSURA HIDETSUGU, HATTORI HIROSHI, SHIMADA SACHIYO, IWASHITA TAKAYUKI
Format Patent
LanguageEnglish
Japanese
Published 06.03.2024
Subjects
DEAF-AID SETS
DIAGNOSIS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
HUMAN NECESSITIES
HYGIENE
IDENTIFICATION
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
MEDICAL OR VETERINARY SCIENCE
PUBLIC ADDRESS SYSTEMS
SURGERY
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Summary:To efficiently guide heat generated in an electronic circuit to a heat absorption member via a backing, in an ultrasonic probe.SOLUTION: A sub-backing 21 with first thermal anisotropy is provided on the rear side of an electronic circuit 37. A main backing 22 with second thermal anisotropy different from the first thermal anisotropy is provided on the rear side of the sub-backing 21. The main backing 22 has two outer surfaces orthogonal to a direction Y which serve respectively as thermal output surfaces. Heat is propagated from the two outer surfaces to a shell as a heat absorption member.SELECTED DRAWING: Figure 2 【課題】超音波プローブにおいて、電子回路で生じた熱を、バッキングを介して、吸熱部材へ効率的に導く。【解決手段】電子回路３７の後側に、第１の熱的異方性を有する副バッキング２１が設けられている。副バッキング２１の後側に、第１の熱的異方性とは異なる第２の熱的異方性を有する主バッキング２２が設けられている。主バッキング２２においてＹ方向に直交する２つの外面がそれぞれ熱出力面として機能する。それら２つの外面から熱吸収部材であるシェルへ熱が伝わる。【選択図】図２
Bibliography:Application Number: JP20220131775