QUANTUM DEVICE

• Main Authors: KIKUCHI MASARU, ISHIHARA KUNIHIKO, WATANABE HIDE
• Format: Patent
• Language: English; Japanese
• Published: 06.03.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CURRENT COLLECTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINE CONNECTORS; SEMICONDUCTOR DEVICES

To provide a quantum device that implements a further efficient cooling function for a quantum chip, ensures connection reliability of externally connected terminals, and can cope with increase in the number of terminals.SOLUTION: A quantum device includes an interposer in which a quantum chip is installed in a flip-chip mount style, a socket including a housing, and a plurality of probe pins which is movable at both ends thereof or movable at one end thereof, and accommodated and held in a plurality of openings, first ends and second ends on an opposite side in an axial direction of the probe pins protruding from first and second surfaces of the housing, respectively. The plurality of probe pins includes a plurality of signal probe pins and a plurality of ground probe pins. In the housing, an inner wall of the opening that accommodates the ground probe pin is covered with a metal layer, and the metal layer of the inner wall of the opening and at least a part of the ground probe pin are in thermal contact with each other. The metal layer of the inner wall of the opening is continuous with a metal layer formed in at least a partial area of at least one of the first surface and the second surface of the housing.SELECTED DRAWING: Figure 4 【課題】量子チップのさらなる効率的な冷却機能を実現し、外部接続する端子の接続信頼性を確保し、かつ、端子数の増大に対向可能な量子デバイスを提供する。【解決手段】量子デバイスは、量子チップをフリップチップ実装したインターポーザと、ハウジングと、複数の開口に収容保持され、軸方向の第１端と反対側の第２端がそれぞれハウジングの第１面と第２面から突出した両端可動又は肩端可動型の複数のプローブピンと、を含むソケットと、を備える。複数のプローブピンは、複数の信号用及び複数のグランド用を含む。ハウジングにおいて、グランド用のプローブピンを収容する開口の内壁は金属層で覆われており、開口の内壁の金属層とグランド用のプローブピンの少なくとも一部は熱的に接している。開口の内壁の金属層は、ハウジングの第１面及び第２面の少なくとも一方の少なくとも一部のエリアに形成された金属層に連なる。【選択図】図４