MULTI-MOLD SYSTEM USING RUNNERS

To provide a runner that reduces resin leakage from the hot runner and reduces the possibility of air entering the molded product during continuous molding.SOLUTION: A runner 2 according to the present invention for supplying resin to a cavity includes: a sprue 4 supplied with resin from a nozzle 1...

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Bibliographic Details
Main Authors TAJIMA JUNKO, KODAIRA KOKI, YANAGIHARA YUICHI
Format Patent
LanguageEnglish
Japanese
Published 05.03.2024
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Summary:To provide a runner that reduces resin leakage from the hot runner and reduces the possibility of air entering the molded product during continuous molding.SOLUTION: A runner 2 according to the present invention for supplying resin to a cavity includes: a sprue 4 supplied with resin from a nozzle 1 of an injection molding machine 200; a first pathway formed in the runner which flows from the nozzle to the first pathway when the nozzle connects to the sprue; and a first pin which moves to a first position to increase the size of the first pathway before the resin is supplied to the first pathway and moves to a second position to decrease the size of the first pathway before the nozzle separates from the sprue.SELECTED DRAWING: Figure 1 【課題】ホットランナーからの樹脂漏れを低減し、連続成形時に成形品に空気が入る可能性を低減する、ランナ-を提供する。【解決手段】キャビティに樹脂を供給するためのランナー2は、射出成形機200のノズル1から樹脂を供給されるスプルー4と、前記ランナー内に形成された第1の経路であって前記ノズルが前記スプルーに接続する場合に前記ノズルから前記第1の経路に流れる、前記第1の経路と、前記第1の経路に前記樹脂が供給される前に前記第1の経路の大きさを増大させるために第1の位置に移動し、前記ノズルが前記スプルーから分離する前に前記第1の経路の大きさを減少させるために第2の位置に移動する第1のピンとを含む。【選択図】図1
Bibliography:Application Number: JP20230202109