SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT DEVICE

• Main Authors: YAMAURA ITARU, TANAKA MIKA, BABA TORU, TAKEUCHI YUMA, KODAMA SHUNSUKE, SAITO TAKAHIRO
• Format: Patent
• Language: English; Japanese
• Published: 28.02.2024
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a sealing resin composition which achieves both flowability and curability in molding and has a low dielectric loss tangent of a cured product, an electronic component device sealed using the same, and a manufacturing method of an electronic component device sealed using the same.SOLUTION: A sealing resin composition contains an epoxy resin containing a polyfunctional epoxy resin and a bifunctional epoxy resin, and a curing agent containing an active ester compound.SELECTED DRAWING: None 【課題】成形時の流動性と硬化性とを両立し且つ硬化物の誘電正接が低い封止用樹脂組成物、これを用いて封止された電子部品装置、及びこれを用いて封止する電子部品装置の製造方法を提供する。【解決手段】多官能エポキシ樹脂及び二官能エポキシ樹脂を含むエポキシ樹脂と、活性エステル化合物を含む硬化剤と、を含有する封止用樹脂組成物。【選択図】なし