ELECTRONIC APPARATUS

• Main Authors: SATO TATSUYA, KANEDA NORIKAZU, MATSUO YUJI, AMANO TAKUYA, ITAYA SHUNSUKE
• Format: Patent
• Language: English; Japanese
• Published: 21.02.2024
• Subjects: ACCESSORIES THEREFOR; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES; APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CINEMATOGRAPHY; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PHOTOGRAPHY; PHYSICS; PICTORIAL COMMUNICATION, e.g. TELEVISION; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide an electronic apparatus using a heat conduction sheet for conducting heat from a cooling target to a heat discharge member, the apparatus increasing the amount of heat movement from the cooling target to the heat discharge member without increasing the contact surface of the heat conduction sheet and the cooling target.SOLUTION: The electronic apparatus includes: a cooling target 58; a heat discharge member; a first heat conduction sheet 110 having a first heat absorption unit 110b for absorbing heat from the cooling target 58 and a first heat discharge unit 110a for discharging heat to the heat discharge member; a second heat conduction sheet 110 having a second heat absorption unit 110c for absorbing heat from the cooling target 58 and a second heat discharge unit 110a for discharging heat to the heat discharge member; and an elastic member 116 for biasing the first and second heat absorption units 110b and 110c and maintaining the connection between the first and second heat absorption units 110a and 110c and the cooling target 88. The elastic member 116 biases the first and second heat absorption members 110b and 110c overlapping each other to the cooling target 58.SELECTED DRAWING: Figure 23 【課題】冷却対象から放熱部材に熱を伝達する熱伝導シートを用いた電子機器において、熱伝導シートと冷却対象の接触面を拡大することなく、冷却対象から放熱部材への熱移動量を増加させる。【解決手段】電子機器は、冷却対象５８と、放熱部材と、冷却対象５８から熱を吸収する第１の吸熱部１１０ｂおよび放熱部材に熱を放出する第１の放熱部１１０ａを備える第１の熱伝導シート１１０と、冷却対象５８から熱を吸収する第２の吸熱部１１０ｃおよび放熱部材に熱を放出する第２の放熱部１１０ａを備える第２の熱伝導シート１１０と、第１および第２の吸熱部１１０ｂ、１１０ｃを付勢し、第１および第２の吸熱部１１０ｂ、１１０ｃと冷却対象８８との接続を維持する弾性部材１１６とを有する。弾性部材１１６が、互いに重なり合う第１の吸熱部１１０ｂと第２の吸熱部１１０ｃを冷却対象５８に向かって付勢する。【選択図】図２３