CONDUCTIVE PASTE FOR SLIT NOZZLE, CURED PRODUCT, AND COATING METHOD OF CONDUCTIVE PASTE FOR SLIT NOZZLE

• Main Author: NISHI TAKAYUKI
• Format: Patent
• Language: English; Japanese
• Published: 16.02.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

To provide a conductive paste for a slit nozzle in which excessive flow is suppressed after discharge.SOLUTION: A conductive paste for a slit nozzle contains silver-containing particles, and an epoxy monomer or an epoxy resin, wherein a viscosity change rate Δη0.5 represented by the following expression (1) is more than 0 and 0.20 or less. Expression (1): Δη0.5=(η0.5(T1)-η0.5(T0))/η0.5(T0). In Expression (1), η0.5(T0) and η0.5(T1) are measured by a predetermined procedure.SELECTED DRAWING: Figure 1 【課題】吐出後において必要以上の流動が抑制されたスリットノズル用導電性ペーストを提供すること。【解決手段】銀含有粒子と、エポキシモノマーまたはエポキシ樹脂と、を含むスリットノズル用導電性ペーストであって、下記式（１）で示される粘度変化率Δη０．５が０より大きく０．２０以下である、スリットノズル用導電性ペースト。Δη０．５＝（η０．５（Ｔ１）－η０．５（Ｔ０））／η０．５（Ｔ０）（１）式（１）中、η０．５（Ｔ０）およびη０．５（Ｔ１）は所定の手順で測定される。【選択図】図１