FILLER APPLICATION DEVICE

• Main Authors: SATAKE MASAYUKI, TAJIMA KAZUHIRO
• Format: Patent
• Language: English; Japanese
• Published: 16.02.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a filler application device which can prevent contamination of an upper surface and/or a lower surface of a lamination substrate due to liquid splash of a filler.SOLUTION: A filler application device 100 comprises: a substrate holding part 33 which holds and rotates a lamination substrate Ws manufactured by bonding a first substrate W1 and a second substrate W2; an application device 39 which is arranged so as to be apart from the lamination substrate Ws held by the substrate holding part 33 and discharges a filler F toward a gap G formed between a peripheral edge part of the first substrate W1 and a peripheral edge part of the second substrate W2; and a protector 12 which prevents adhesion of liquid splash Fs of the filler F generated when the filler F discharged from the application device 39 collides with the gap G to the upper surface and/or lower surface of the lamination substrate Ws.SELECTED DRAWING: Figure 1 【課題】充填剤の液跳ねによって積層基板の上面および／または下面が汚染されることを防止することが可能な充填剤塗布装置を提供する。【解決手段】充填剤塗布装置１００は、第１基板Ｗ１と第２基板Ｗ２とを接合して製造される積層基板Ｗｓを保持して回転させる基板保持部３３と、基板保持部３３に保持された積層基板Ｗｓから離間して配置され、第１基板Ｗ１の周縁部と第２基板Ｗ２の周縁部との間に形成された隙間Ｇに向けて充填剤Ｆを吐出する塗布装置３９と、塗布装置３９から吐出された充填剤Ｆが隙間Ｇと衝突する際に発生する充填剤Ｆの液跳ねＦｓが積層基板Ｗｓの上面および／または下面に付着することを阻止するプロテクタ１２と、を備える。【選択図】図１