HEAD FOR EJECTING REACTIVE GAS FOR DEPOSITING FILM AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: ARAKI YOSHIHITO, KANEDA NORIYOSHI
• Format: Patent
• Language: English; Japanese
• Published: 16.02.2024
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

To provide a head that can evenly eject a reactive gas for depositing a film in a film deposition apparatus, and to provide a method for manufacturing the same.SOLUTION: A method for manufacturing a head includes the steps of: diffusion joining a first plate and a second plate to each other; and forming a nickel-containing film at surfaces of the first plate and the second plate with electroless plating after the diffusion joining. The first plate and the second plate are configured to have a flow channel so that a reactive gas passes through from the first plate to the second plate while the first plate and the second plate are joined.SELECTED DRAWING: Figure 5 【課題】成膜装置内で成膜用反応性ガスを均一に射出可能なヘッド、およびその製造方法を提供すること。【解決手段】ヘッドの製造方法は、第１のプレートと第２のプレートを互いに拡散接合すること、および、拡散接合の後、第１のプレートと第２のプレートの表面にニッケル含有膜を無電解めっきで形成することを含む。第１のプレートと第２のプレートは、接合された状態において、反応性ガスが第１のプレート側から第２のプレート側へ通過する流路を有するように構成される。【選択図】図５