RESIN COMPOSITION, CURED PRODUCT, RESIN FILM, PREPREG, LAMINATE, AND MATERIAL FOR ELECTRONIC CIRCUIT SUBSTRATES

• Main Authors: TAKEDA KEIJI, MATSUOKA YUTA
• Format: Patent
• Language: English; Japanese
• Published: 15.02.2024
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

To provide a conjugated diene-based copolymer or the like, which can yield a cured product with low dielectric constant and low dielectric loss tangent, and superior tensile strength.SOLUTION: A resin composition includes component (I), and at least one component selected from components (II)-(IV). Component (I): a conjugated diene-based copolymer that includes a random copolymer block (C) predominantly composed of a vinyl aromatic monomer unit and a conjugated diene monomer unit, and a polymer block (A) predominantly composed of a vinyl aromatic monomer unit and/or a polymer block (B) predominantly composed of a conjugated diene monomer unit and satisfies the following conditions. Condition (i): the conjugated diene-based copolymer has a weight average molecular weight of 35,000 or more; (ii) the content of the vinyl aromatic monomer unit in the (C) is 45 mass% or more; and (iii) the content of the vinyl aromatic monomer unit in the conjugated diene-based copolymer is 45 mass% or more and 90 mass% or less. Component (II): a radical initiator. Component (III): a polar resin (excluding component (I)). Component (IV): a curing agent (excluding component (II)).SELECTED DRAWING: None 【課題】低誘電率及び低誘電正接であり、引張強度にも優れた硬化物が得られる共役ジエン系共重合体等の提供。【解決手段】成分（Ｉ）と、成分（ＩＩ）～（ＩＶ）より選ばれる少なくとも１種の成分と、を含む樹脂組成物。成分（Ｉ）：ビニル芳香族単量体単位と共役ジエン単量体単位を主体とするランダム共重合体ブロック（Ｃ）と、ビニル芳香族単量体単位を主体とする重合体ブロック（Ａ）及び／又は共役ジエン単量体単位を主体とする重合体ブロック（Ｂ）と、を有し、下記条件を満たす共役ジエン系共重合体（ｉ）共役ジエン系共重合体の重量平均分子量が３．５万以上（ｉｉ）前記（Ｃ）中のビニル芳香族単量体単位の量が４５質量％以上（ｉｉｉ）共役ジエン系共重合体中のビニル芳香族単量体単位の量が４５質量％以上９０％以下成分（ＩＩ）：ラジカル開始剤成分（ＩＩＩ）：極性樹脂（成分（Ｉ）を除く）成分（ＩＶ）：硬化剤（成分（ＩＩ）を除く）【選択図】なし